It breaks through the aperture bottleneck of traditional drilling equipment, enabling precision processing of ultra-micro holes as small as 0.001mm. The precision of aperture, hole spacing and roundness reaches sub-micron level, with the maximum aspect ratio up to 1:120, easily solving the processing difficulty of large-aspect-ratio ultra-fine micro holes. The finished holes are regular and round, free of taper deviation and size difference, supporting stable single-hole precision processing and mass forming of high-density array micro holes, meeting the extreme fine micro-hole standard of high-end manufacturing

Adopting high-end ultraviolet/ultrafast laser pure cold ablation technology, the heat affected zone is controlled within 5μm. There is no high-temperature burning, thermal diffusion or material carbonization during processing. Whether for brittle ceramic/glass, ultra-thin film, cemented carbide or semiconductor substrates, it achieves processing free of edge chipping, cracks, thermal deformation and recast layer. The hole wall smoothness can reach mirror level, no secondary post-processing (grinding, polishing, cleaning) is required, fundamentally eliminating processing defects

Breaking through the material limitation of conventional drilling equipment, it is equipped with Jiajiajia's self-developed full-material intelligent process database, which automatically matches exclusive processing parameters for different materials. It fully adapts to all categories of materials: metals (stainless steel, titanium alloy, alloy plates, precision nozzles), non-metals (acrylic, film, silica gel, plastic), brittle materials (ceramic, glass, quartz), semiconductors (silicon wafers, substrates), etc. One machine covers micro-hole processing demands of multiple scenarios including medical, electronics, new energy, aerospace and filter consumables, with extremely strong universality

Equipped with a high-definition dual CCD visual automatic positioning system, it supports automatic workpiece alignment, automatic typesetting, automatic position avoidance and dynamic deviation correction. Complex micro-hole drawings can be imported with one click for fully automatic mass production. No frequent manual parameter debugging, precision fixture fixing or secondary alignment correction is required, which completely eliminates accuracy deviation caused by manual intervention. The hole position, aperture and hole depth of batch products are highly consistent, and the mass production yield is stably above 99.9%

Adopting the principle of laser non-contact ablation processing, there is no drill extrusion, mechanical friction or stress residue, completely solving the problems of collapse, tensile deformation, cracking and damage when drilling on ultra-thin sheets, flexible films and brittle substrates. It is especially suitable for ultra-precision micro-hole processing of 5μm ultra-thin sheets, fragile ceramic/glass and flexible polymer materials, maximizing the retention of the original structure and performance of the workpiece material

It replaces multiple processes of traditional mechanical drilling, EDM drilling and ordinary laser drilling, eliminates post-processing procedures such as grinding, cleaning and rework, improves processing efficiency by 6-12 times, and greatly saves costs of labor, consumables and equipment procurement. The equipment adopts a thickened shock-proof precision frame and high-end core components, maintains stable performance without accuracy drift during long-term high-frequency mass production, requires no major overhaul for 7 years, and features low operation cost and high output, which is suitable for 24-hour unattended continuous mass production in high-end manufacturing